Your July round-up of the latest electronic news, products and resources from CUI

New Products



6~20 W Encapsulated Ac-Dc Power Supplies

CUI's PSK series of low power encapsulated ac-dc power supplies are ideal for space-constrained applications, delivering high efficiency and improved no-load performance in a compact PCB package.

  • 6~20 W continuous power
  • Compact package as small as 2 x 1 in
  • No-load power consumption < 100 mW
  • 85~264 Vac input voltage range
  • 4,000 Vac isolation
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Board Level Heat Sinks

The space-saving HSS and HSE series make up CUI’s new line of aluminum heat sinks, available in a variety of form factors for a range of transistor packages.

  • Designed for TO-218, TO-220, TO-252, and TO-263 transistor packages
  • Stamped and extruded designs
  • Variety of form factors
  • Available with and without solder pins
  • Thermal resistance down to 4.49°C/W @ 75°C ΔT, nat conv
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3 W Isolated Dc-Dc Converters

Ideal for converting and isolating fluctuating dc voltages in devices where energy consumption is a concern, the PQME3 series features a 4:1 input range in a compact, 14-pin SMT package.

  • 3 W continuous power
  • Efficiency up to 84%
  • -40°C to +85°C temperature range
  • No load power consumption < 0.1 W
  • 1,500 Vdc isolation
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How to Design a Micro Speaker Enclosure

The design of speaker enclosures is a balance between conflicting parameters, but acceptable compromises can be achieved with a minimum amount of effort. By adhering to these simple guidelines in this blog post, excellent sound quality can be achieved from mini and micro speakers without the need of an audio expert.

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Additional Resources



Medical Design Standards for Power Supplies

This paper examines the IEC 60601-1 medical standard and its impact on power supply design. With the coming implementation of 4th edition, engineers who design power supplies into medical applications must stay current on the latest regulations to ensure they are in compliance in each region where their product is sold.

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arcTEC™ Structure – Improved Performance & Life Span in Peltier Modules

This application note takes a look at CUI’s arcTEC™ structure, found in its line of high performance Peltier modules, versus general Peltier module construction. Learn how the arcTEC structure provides improved performance and reliability, outperforming conventional thermoelectric cooler designs.

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Power Forward: How 5G is Changing Data Centers

In this EDN Power Forward blog post, Mark Adams, CUI’s Senior VP, highlights the impending availability of 5G network technology, the resulting strain that 5G data will put on data center power infrastructure, and the Software Defined Power® solution being developed to solve those challenges.

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