Specifications


  • Package Cooled
     
    TO-263
  • Mounting Style
     
    Surface Mount
  • Solder Pin Orientation
     
    No Pin
  • Thermal Resistance @ 75°C ΔT, nat conv (°C/W)
     
    19.74
  • Thermal Resistance @ 1 W, nat conv (°C/W)
     
    21.9
  • Thermal Resistance @ 1 W, 200 LFM (°C/W)
     
    5.5
  • Thermal Resistance @ 1 W, 400 LFM (°C/W)
     
    4
  • Power Dissipation @ 75°C ΔT, nat conv (W)
     
    3.8
  • Dimensions LxWxH (mm)
     
    19.38 x 25.4 x 11.43
  • Material
     
    C1100
  • Material Finish
     
    Tin Plated