Specifications


  • Package Cooled
     
    TO-263
  • Mounting Style
     
    Surface Mount
  • Solder Pin Orientation
     
    No Pin
  • Thermal Resistance @ 75°C ΔT, nat conv (°C/W)
     
    35.71
  • Thermal Resistance @ 1 W, nat conv (°C/W)
     
    40.16
  • Thermal Resistance @ 1 W, 200 LFM (°C/W)
     
    8.15
  • Thermal Resistance @ 1 W, 400 LFM (°C/W)
     
    6.53
  • Power Dissipation @ 75°C ΔT, nat conv (W)
     
    2.1
  • Dimensions LxWxH (mm)
     
    14.99 x 25.91 x 9.52
  • Material
     
    C1100
  • Material Finish
     
    Tin Plated