CUI Inc today announced that the company will present and exhibit at the upcoming Applied Power Electronics Conference (APEC) held on February 5-9, 2012 in Orlando, Florida. APEC is a leading power electronics event that focuses on both practical and applied aspects of the power electronics business.
The company will have a significant presence at the show this year. CUI’s CTO, Don Li, will present his paper “A SEPIC Fed Buck Converter.” The paper examines how CUI’s new Solus™ Power Topology addresses the critical issues confronting the power electronics field today: efficiency, power density and transient response.
In the company’s exhibitor seminar, CUI’s VP of Advanced Power Marketing, Mark Adams, will address the issues associated with interoperability in digital power systems and the solutions offered through CUI’s Novum® Advanced Power division.
CUI’s booth will feature product demonstrations that include the company’s second generation digital POL dc-dc modules based on the cooperation announced in July 2011 with Ericsson, as well as their 720 W intermediate bus quarter brick converter based on the Solus Topology.
“We are excited to play such an active role at this year’s APEC conference,” said Adams. “We have worked diligently over the past year to design modules that meet the needs of next generation distributed power systems and we are looking forward to demonstrating our technology at this event,” Adams concluded.
Date: February 5-9, 2012
Venue: Walt Disney World Resort, Orlando, Florida
CUI Booth: 412/414
CUI Technical Presentation: A SEPIC Fed Buck Converter
Thursday, February 9, 2:00-5:30 pm
Technical Session: DC-DC Converters: High Performance
Room: Coronado A/B
CUI Exhibitor Seminar: Overcoming Interoperability Challenges in Digital Power Systems
Tuesday, February 7, 3:00-3:30 pm
Room: Coronado E/F
For more information about the conference, please visit: http://www.apec-conf.org/.