Heat Sinks


Stampings and Extrusions to Improve Heat Dissipation in Your Application

Our stamped and extruded heat sinks are the ideal solution for improving the heat dissipation of both low and high power board level designs. Compatible with TO-218, TO-220, TO-252, and TO-263 transistor package types and available in a variety of standard shapes and sizes, our aluminum and copper heat sinks are conveniently measured under four conditions for thermal resistance, making it easier to select the optimal extrusion or stamping for your natural convection or forced air cooled system.

Heat Sinks

Extruded Heat Sinks

View our line of extruded aluminum heat sinks that offer complex fin structures and greater surface area for increased heat dissipation in higher power applications.

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Stamped Heat Sinks

Ideal for lower power PCB cooling, our stamped aluminum and copper heat sinks are a cost-effective thermal solution for space-constrained applications.

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Featured Products


HSS-B20-01 Series

Stamped Heat Sink, TO-220, Aluminum, PCB

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HSS-B20-NPX-01 Series

Stamped Heat Sink, TO-220, Aluminum, PCB

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HSE-18X Series

Extruded Heat Sink, TO-218, Aluminum, PCB

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